SQC Online

Bipolar & MOS Digital and Linear Gate/Logic Array MTBF, MIL-HDBK-217, Rev. F - Notice 2

Learn about Environmental Test Chambers

To calculate the MTBF and failure rate using the MIL-HDBK-217F failure model, enter the chip's parameters in the following table.

Parameter ValueNotes
Microcircuit type  
Package type 1. DIP: Dual In-Line Package
2. SMT: Surface Mount Technology
3. If DIP Seal type is unknown, assume glass
Number of pins    
Technology   Select digital MOS for HC, HCT, AC, ACT, C and FCT technologies.
Quality Class S Categories
Class B Categories
Class B-1 Categories
Commercial or unknown screening levels
Custom screening
 If "Custom screening" selected, specify tests on the next row. Click here to learn about the categories.
Custom screening Group 1
Group 2
Group 3 (B Level)
Group 3 (S Level)
Group 4
Group 5
Group 6
Group 7
Group 8
Group 9
Group 10
Group 11
 Only valid if "custom screening" was selected. Click here to learn about test groups.
Environment Environment codes
Years in production Number of years generic device type has been in production
Temperature (°C) (2)

Notes

Back